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NEC Electronics America Introduces MOSFET Devices with Super Low On ResistanceInnovative Trench Configurations and Advanced Packaging Solutions Reduce On-Resistance SANTA CLARA, Calif., October 17, 2005 — NEC Electronics America, Inc. today introduced the NP Series of power MOSFETs, the newest member of the company’s recently announced line of power management devices (PMDs). The NP Series features a combination of innovative trench technologies and advanced packaging solutions that result in low leakage current and enable one of the lowest on-state resistances (Rds(on)) in the industry: 1.4 milliohms (typical). The new MOSFETs target markets requiring efficient power management and high current capability, such as automotive and low-voltage motor control. The first device in the series, the NP110, is available now. “We are seeing an increasing demand for power management devices that are smaller and more power-efficient, yet still provide the high current capabilities and reliability required by automotive systems, motor control applications, DC/DC converters and uninterruptible power supplies,” said Bart Ladd, general manager, standard solutions strategic business unit, NEC Electronics America. “NEC Electronics’ NP Series meets this market demand and serves as another indicator of the company’s commitment to providing customers with proven, high-quality, innovative solutions for an extensive variety of system designs.” By combining the company’s UMOS-4 process technology with a trench configuration, NEC Electronics has increased the MOSFET’s cell density, resulting in decreased R ds(on). The UMOS-4 process reduces the size of the trenches and other structures with an ultra-fine 0.25-micron design rule. In addition, by fabricating MOSFET structures along the sides of the trenches, designers can reduce the amount of silicon space required. Together, these technologies achieve a cell density of well over 180 Mcells/inch 2. The NP Series also features advanced TO-263 and TO-252 packages fabricated with a unique multi-bonding technology that increases the number of bonding wires from two and three to three and four, respectively. This additional bonding capability enables the MOSFET to manage high currents with very low on-resistance, all in a relatively small package that needs less battery power and less board space, resulting in easier management of heat dissipation. The NP Series is part of NEC Electronics America’s family of low-voltage switching devices that provides efficient power management in high-frequency power supplies and motor control systems in automotive, motor control, office, robotic, and uninterruptable power applications. Additional information about NEC Electronics America’s PMD product lines can be found at www.am.necel.com/pmd. Pricing and Availability
About NEC Electronics America, Inc.
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