Top Benefits of 100-Ball Ball Grid Array (BGA) Packaging

Oct 23, 2014
 

Ball grid array (BGA) packages are a surface-mount or chip carrier packaging for integrated circuits and mounting devices like microprocessors. BGA packages offer higher pin density, lower thermal resistance, and lower inductance than other types of packages. This means more interconnection pins and increased performance at high speeds as compared to dual in-line or flat packages.

 

BGA is not without its disadvantages, though. The solder balls are unable to flex in the same manner as longer leads, and the package density can make it difficult to inspect for faults or other aberrations. Additionally, reliable soldering equipment for large production runs can be very costly.

 

Disadvantages aside, 100-ball BGA packaging is still an attractive option for many applications. Silicon Motion, a leader in the development of microcontroller ICs for NAND flash storage devices and specialty RF ICs for mobile devices, leverages 100-ball BGA packaging in their Ferri-eMMC memory solutions.

 

Silicon Motion’s 100-ball BGA Package Ferri-eMMC

Silicon Motion’s Ferri-eMMC is optimally designed for a number of embedded applications. Ferri-eMMC is fully compliant to the industrial standard eMMC/JEDEC 4.5 protocal. With a 100-ball BGA, 1.0mm pitch package design, Ferri-eMMC provides for flexible PCB design and low-cost manufacturing.

The Ferri-eMMC also includes high-efficiency error correction with an advanced hardware BCH error correcting code (ECC) engine and StaticDataRefresh™ and EarlyRetirement™ technologies to ensure data reliability; advanced global wear leveling through even distribution of program/erase cycles across all NAND flash chips to maximize the usage lifespan with low Write Amplification Index (WAI); and robust data protection through advanced system level protection against unstable power, software/hardware write protect options, multiple user data security zones, software/hardware secure erase function, and PowerShield™ and DataPhoenix™ technologies prevent data corruption in case of sudden power loss.

 

Features and Advantages of the Ferri-eMMC 100-ball BGA Package

  • 100-ball BGA
    • JEDEC industry-standard mechanical ball pattern
    • Easy PCB traces routing and layout
    • High PCB/SMT yields
    • Excellent long-term reliability
    • Low ball count reduces PCB cost
  • 1.00 mm ball pitch / 0.45 mm ball diameter
    • Easy PCB trace routing and layout
    • Reduced cost of PCB trace routing and design
    • Reduced number of PCB layers
    • Better thermal dissipation
    • Higher PCB yield
    • Excellent PCB reliability
  • Compatibility
    • Usable in most industry grade solutions
    • Package qualified by OEMs
    • Compatible with all 100B industry grade solutions

 

Ready to implement Silicon Motion’s 100-ball BGA packaging into your application? Call Symmetry Electronics at (310) 536-6190, or contact us online



Written By: Stephanie Guimera

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