From Digi: "Digi International Highlights Latest IoT Connectivity Solutions and Customer Use Cases at Embedded World 2019"

Apr 2, 2019
 
 

Digi to Exhibit ConnectCore 8X System-on-Modules (SOMs) and Single-Board-Computers (SBCs) and related Development Kits Along with Digi XBee3 Modules and Modems at Premier International IoT Event

Digi International®, (NASDAQ: DGII, www.digi.com), a leading global provider of Internet of Things (IoT) connectivity products and services, today announced that it will showcase its ConnectCore® 8X system-on-modules and SBCs, and the Digi XBee3® series of modules and modems at Embedded World 2019. Additionally, Digi will host demonstrations and educational sessions that will illustrate the latest in embedded technology and its capabilities. Embedded World takes place in the Exhibition Centre Nuremberg, February 26-28, 2019. Digi will be exhibiting its solutions in Hall 3, booth 629.
 
At the event, Digi will introduce ConnectCore 8X development kits, which are designed to provide hardware and software engineers, corporate technologists, and even educators and students with the opportunity to gain hands-on experience in integrating connectivity into their IoT solutions and applications.
 
Digi’s extremely small, Digi SMTplus® form factor ConnectCore 8X system-on-module (SOM) and single board computer (SBC) utilize the NXP i.MX 8 QuadXPlus processor  family based on ARM® Cortex®-A35 and Cortex-M4F cores. Designed for ultimate reliability and design freedom, the ConnectCore 8X offers 2X2 MIMO 802.11ac + Bluetooth® Smart connectivity, graphics, video, image processing, audio/voice capabilities, as well as Digi TrustFence® security for advanced IoT applications for highly regulated sectors including medical/healthcare, transportation, building automation, advanced HMI, and industrial.
 
The Digi XBee3 series of smart edge RF modules and cellular modems are built on an incredibly small micro form factor  and designed to support IoT innovation at the network edge. With a modular approach to IoT connectivity, the Digi XBee3 series enables the integration of new functions with MicroPython programmability, dual-mode radios and the ability to upgrade firmware over-the-air (OTA). These functionalities enable wireless design flexibility, cost-effective integration and easily added custom business logic at the network edge. The result is innovative IoT solutions that can be more quickly developed, prototyped and mass-produced.
 
“So much of the IoT is centered around embedded technology and this is the foremost venue to highlight what Digi International brings to the space,” said Mike Ueland, senior vice president, Digi International. “We’re excited to present our use cases and partnership stories as we use Embedded World as the launching pad for the ConnectCore 8X, as we did with the Digi XBee3 series, which has seen a hugely positive response in the industry.”

 

Source: https://www.digi.com/news/press-releases/new-iot-solutions-at-ew19 

 

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