From MediaTek: "Anritsu?s MT8000A 5G Tester Contributes to Verify the Advanced Technologies of MediaTek?s 5G Modem"
MT8000A confirms MediaTek Helio M70 readiness for 5G rollout
Anritsu and MediaTek today announced MediaTek‘s Helio M70 5G modem has achieved the maximum downlink and uplink throughput using Anritsu’s Radio Communication Test Station MT8000A, providing a flexible test platform for ultrafast, large-capacity 5G communications using wideband signal processing and beamforming.
With its cutting-edge NSA and SA modes, the all-in-one MT8000A supports sub-6 GHz and mmWave RF tests as well as protocol tests for development of advanced 5G technologies, such as 4x4 MIMO, to increase data speeds in the sub-6 GHz band.
MediaTek’s Helio M70 is the only 5G modem with both LTE and 5G dual connectivity (EN-DC), supporting every cellular generation from 2G to 5G. Designed for 3GPP Release 15 compliance and supporting non-standalone (NSA) and standalone (SA) 5G network architectures, the Helio M70 can connect to 5G NR and 4G LTE bands worldwide while supporting High Power User Equipment (HPUE) and other key carrier features.
“Working with Anritsu, we’ve thoroughly tested our Helio M70 5G modem to ensure it’s ready for the market rollout of ultra-fast connectivity with 5G networks” said JS Pan, General Manager of Wireless System Design and Partnership at MediaTek. “With multimode support - for 2G, 3G, 4G and 5G connectivity - Helio M70 powered devices will give consumers a seamless connectivity experience wherever they go.”
“We are working with MediaTek to help accomplish its vision of advanced 5G technology benefitting everyone,” said Yoshiyuki Amano, Anritsu’s Vice President. “Our tests with the MT8000A have verified that the Helio M70 makes full use of 5G maximum downlink and uplink throughput speeds.”
MediaTek’s Helio M70 is among the industry’s first wave of 5G multi-mode integrated baseband chipsets. With its multi-mode solution, the Helio M70 simplifies the design of 5G devices with a comprehensive power management plan, enabling companies to design mobile devices with a smaller form factor, improved energy efficiency and sleek appearance. The Helio M70 baseband chipset is available now, and is expected to ship in the second half of 2019.
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