The Embedded Enterprise Chipsets offer three different configurations to meet your needs, the SR5690, SR5670 and the SR5650. All three versions of I/O bridges from the SR5690 with 42 PCIe® lanes and 11 engines, to the SR5670 with 30 PCIe lanes with 9 engines, down to the SR5650 with 22 PCIe lanes and 8 engines paired with the SP5100 southbridge offer HyperTransportTM 3.0 technology, PCIe Generation 2, SATA 2.5 and USB 2.0. Additionally all three offer enterprise features such as HT error handling, PCIe AER, Data Poisoning Passthrough, PCIe end-to-end CRC and AMD-Vi (IOMMU 1.2).
These chipset combinations combined with AMD Embedded Processor offerings are targeted at embedded applications such as telecom, storage, test and measurement, and industrial automation. The growing demands of embedded enterprise applications are served by this new solution through reliability, scalability and excellent power efficiency.
All three combinations of Embedded Enterprise Chipsets (SR5690/SP5100, SR5670/SP5100, SR5650/SP5100) are compatible with all AMD embedded processors including high performance AMD Opteron™ processors, socketed AM2 low power single and dual-core AMD Athlon™ processors and very low power AMD Athlon, AMD Sempron™ and AMD Turion™ ASB1 (BGA) processors. In addition two I/O bridges can be used in the same system in any combination (SR5690/SR5690, SR5690/SR5670, etc). This level of flexibility helps you to design a solution that best fits your performance, power and I/O needs and with pin and socket compatibility in each processor package type, one design can meet a wide range of performance and power points.
Power and thermal design are important to all embedded enterprise applications. Consequently, the AMD Embedded Enterprise Chipsets are designed with power in mind. The SR5690/SR5670/SR5650 and SP5100 support both low power and high Tcase, allowing them to be used in compact designs.