High Speed Laser Module (TO)

Manufacturer:
MFG Part #:

iC-HG iCSY HG8M

Part #:
IC-HGICSYHG8M
Availability:
Short Lead Time
RoHS Status:
Unit Price:$72.50
Qty:
Minumum Qty: 1
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Product Information

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Module must be baked before exposing to high temperature processes (e.g. reflow soldering) to avoid delamination, PCB/VIA damages and popcorning (min 24 h at 100 °C). The PCB has a very low thermal resistance that makes manual soldering of SMT devices difficult.

IC-HGICSYHG8M

Symmetry Electronics (and its e-commerce division: SemiconductorStore.com) is an authorized iC-Haus distributor.
 

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Datasheet

Previously Viewed Products

High Speed Laser Module (TO)
Part #: iC-HG iCSY HG8M
High Speed Laser Module (TO)