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Why should I migrate to G-T16R?
- Lower average power consumption 2.3W vs. 2.45W
- Support 64-bit OS with additional instruction sets, SSE, SSE2, SSE3 etc., to facilitate latest software development
- Unparalleled video processing unit, featuring Radeon HD6000 series with hardware video acceleration engine
- Most up to date video display interface, DisplayPort, LVDS and HDMI etc.
- AMD-V™ support for virtualized application development
- Lower cost, faster, higher capacity DDR3 memory replaces DDR1 used by Geode LX series
- Legacy I/O (ISA with DMA) still supported via companion Hub controller
Processor Comparison: Geode LX800 vs. G-T16R
Architecture |
x86 32-bit Scalar |
x86 64-bit Superscalar w/ full OOO Execution |
x86 CPU Cores |
1 |
1 |
Clock Speed |
500MHz |
615MHz |
Memory |
DDR1 64-bit @ 400MT/s |
DDR3 64-bit @ 1066MT/s |
L1 Cache |
64KB/64KB |
32KB/32KB |
L2 Cache |
128KB Unified |
512KB L2 |
FPU |
MMX™, 3DNow! |
SSE1,2,3, SSSE3 ISA, SSE4A, MMX™ |
Virtualiation |
DirectX® 9 (2D) |
DirectX® 11 3D |
I/O |
VIP / VOP |
1 x4 PCIe® gen 2 (configurable) |
Video Acceleration |
External |
Internal: UVD 2.0 |
Video Processing |
Supports video scaling, mixing and VOP, Hardware video up/down scalar, Graphics/video alpha blending and color key multiplexing |
HD HQV and SD HQV support: noise removal, detail enhancement, color enhancement, cadence detection, sharpness, and advanced de-interlacing, super up-conversion for SD to HD resolutions |
Video Output |
Single: CRT, TFT |
Dual Independent: DisplayPort, eDP, HDMI, DVI, LVDS, VGA |
Max Display Resolution |
1920x1440x32-bpp @ 85Hz |
1920x1200 @ 60Hz |
Southbridge / Companion Device Connection |
PCI 33/66MHz |
"UMI": 1 x4 PCIe |
Security |
128-bit AES (CBC/ECB), True Random Number Generator None |
None |
Debug |
JTAG - FS2 (Inactive) |
JTAG - Sage (Acive) |
Power Consumption |
TDP = 3.9W (Max) Average = 2.45W |
TDP = 4.5W (Max) Average = 2.3W |
Technology |
13nm |
40nm |
Package |
481-terminal BGA cavity up |
413-terminal BGA ("FT1") |
Solution footprint |
40 x 40mm + 23 x 23mm = 2129mm2 |
19 x 19mm + 23 x 23mm = 890mm2 |
Ethernet |
External PCI device |
Internal (A55E) or through PCIe (A50M) |
BootROM |
LPC |
SPI |
Hub (companion I/O controller chip) Comparison
Processor Connection |
PCI 66MHz |
PCIe - x4 gen 1 |
PCIe - x4 gen 2 |
Clock Generation |
|
√ |
√ |
Ethernet MAC, EEE |
|
|
√, Gigabit MAC |
Hard Drive |
ATA 66 |
SATA - 6 x 6Gb/s |
SATA - 6 x 6Gb/s |
Flash |
NAND Flash and/or NOR Flash |
|
|
RAID, FIS-Based Switching |
|
|
√, 0/1/5/10 |
Audio |
AC '97 DMA Audio |
HD Audio - up to 4 channels |
HD Audio - up to 4 channels |
PCIe |
|
x 1 gen 1 |
4 x 1 gen 2 |
PCI |
PCI 66 |
|
32-bit, 33MHz up to 4 slots |
I/O |
LPC, SMBus, UART, up to 16 GPIO |
SPI, LPC, SMBus, up o 102 GPIO |
Spi, LPC, SMBus, up to 102 GPIO |
USB 2.0 + 1.1 ports |
3 Host Ports, 1 Host/Client |
14 + 2 |
14 + 2 |
APU Fan Control |
|
√ |
√ |
Consumer IR |
√ |
√ |
√ |
RTC |
√ |
√ |
√ |
MCTP |
|
√ |
√ |
Boot |
LPC |
SPI |
SPI |
Power Consumption |
TDP = 0.65W
Average = 0.425W |
TDP = 5.9W (Max)
Average = 0.965W |
TDP = 5.9W (Max)
Average = 0.965W |
Package |
208-pin PBGA
23mm x 23mm |
605-pin FCBGA
23mm x 23mm |
605-pin FCBGA
23mm x 23mm |
AMD G-Series Accelerated Processing Units
T56N |
GET56NGBB22GVE |
FT1 413-pin µBGA 19mm2 |
2 |
512KB |
DDR3-1333, Unbuffered |
1.65GHz |
AMD Radeon™ HD 6320 |
See the full chart → |
T44R |
GET44RFPB12GVE |
1 |
512KB |
DDR3-1066, Unbuffered |
1.2GHz |
AMD Radeon™ HD 6250 |
T16R |
GET16RFWB12GVE |
1 |
512KB |
LVDDR3-1066 |
615MHz |
AMD Radeon™ HD 6250 |
T48L |
GET48LGBB22GVE |
2 |
512KB |
DDR3-1066, Unbuffered |
1.4GHz |
N/A |
T30L |
GET30LGBB12GVE |
1 |
512KB |
DDR3-1066, Unbuffered |
1.4GHz |
N/A |
T24L |
GET24LFQB12GVE |
1 |
512KB |
DDR3-1066, Unbuffered |
1.0GHz |
N/A |
See the full chart ↓
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Need a little more muscle?
Introducing AMD Embedded G-Series System-on-Chip (SOC)
The AMD Embedded G-Series SOC platform is a high-performance, low-power System-on-Chip (SOC) design, featured with enterprise-class error-correction codec (ECC) memory support, dual and quad-core variants, integrated discrete-class GPU and I/O controller on the same die.
The AMD G-Series SOC achieves superior performance per watt in the low-power x86 microprocessor class of products when running multiple industry standard benchmarks. This helps enable the delivery of an exceptional HD multimedia experience and provides a heterogeneous computing platform for parallel processing. The small-footprint, ECC capable SOC sets the new foundation for a power efficient platform for content-rich multimedia processing and workload processing that is well-suited for a broad variety of embedded applications.
Architectural Overview of the AMD G-Series SOC
1st Generation APU SOC Design
Click on image to enlarge
- Integrates Controller Hub functional block as well as CPU+GPU+NB
- 28nm process technology, FT3 BGA package, 24.5mm x 24.5mm
- Dual- or Quad-"Jaguar" CPU cores with 2MB shared L2 cache
Next Generation Graphics Core
- Compute performance (GFLOP) improvement
- DirectX® 11.1 graphics support
Memory Support: Single-Channel DDR3
- Up to 2 UDIMMs or 2 SO-DIMM DDR3-1600 @ 1.35V & 1.25V
- Support for ECC DIMMs
Integrated Display Outputs
- Supports two simultaneous displays
- Supports 4-len DisplayPort 1.2, DVI, HDMI™ 1.4a, Integrated VGA and Integrated eDP or 18bpp single channel LVDS
Updated I/O
- Four x1 links of PCIe® Gen 2 for GPPs
- One x4 link of PCIe Gen 2 for discrete GPU (not on lower TDPs)
- 8 USB 2.0 + 2 USB 3.0
- 2 SAATA 2.x/3.x (up to 6Gb/s)
- SD Card Reader v3.0 or SDI controller
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