Nordic Semiconductor Global Tech Tour to Help Embedded Systems Developers Build Connectable Wireless Bluetooth Smart and ANT 'appcessories' in 1 Day

Aug 17, 2012
Oslo, Norway – August 15, 2012 – Ultra low power (ULP) RF specialist Nordic Semiconductor ASA (OSE: NOD) today announces that with the launch of its ground-breaking nRF51 Series (nRF51422, nRF51822) of System-on-Chips (SoCs) it will embark on a Global Tech Tour in which a team of the company's top wireless application technical experts will travel around the world to teach embedded systems developers in just one day how to develop their first/next generation Bluetooth Smart or ANT+ ULP wireless smartphone application accessory or 'appcessory' for short.
Each seminar is designed to be intensive, fun, and fully hands-on, and will include a detailed technical walk-through starting from a ULP wireless sensor within an appcessory through how it wirelessly connects to a smartphone and ending with how this all interfaces to a developer's app running on the smartphone's operating system. The agenda will include an overview of ULP wireless, Nordic's latest nRF51 Series SoCs, Bluetooth low energy (including Bluetooth Smart) qualification, and a full afternoon of software development application examples taken from Nordic's brand new nRF51 SDK (Software Development Kit) which each participant will be able to take home free-of-charge.
"Each of these Global Tech Tour seminars is designed to be far more than a set of presentations given in PowerPoint format," explains John Leonard, Tactical Marketing Manager at Nordic Semiconductor. "They will be a genuine and unique opportunity for smartphone app developers to kickstart their next Bluetooth Smart or ANT+ application accessory within a single day with the help of some of the world's most experienced and knowledgeable ULP wireless application engineers and system software architects. In fact I would not be surprised if a sizeable number of participants went away with the knowledge they need to start building their first or next generation smartphone appcessory immediately."
The Global Tech Tour will start in the U.S. on September 17 starting at Minneapolis and then travelling to San Jose in California (Sep 19), Orange County in Irvine (Sep 21), and ending in Boston on September 24. This will be followed by an 8-location tour in Asia Pacific starting in India (Bangalore) on October 3 and then travelling to Singapore (Oct 5), Taiwan (Oct 8), and then onto China – Shenzhen (Oct 10), Shanghai (Oct 12), and Beijing (Oct 15) – followed by South Korea (Seoul) on October 17 and ending in Japan (Tokyo) on October 19. A final European leg of the tour will then begin in Amsterdam in the Netherlands on October 22, moving to Paris, France (Oct 24), Munich, Germany (Oct 26), and ending in Copenhagen, Denmark (Oct 29).
To be held in 16 separate locations in the U.S, Asia, and Europe between September 17 and October 29 and designed to coincide with the launch of Nordic's ground-breaking nRF51 Series of 2.4GHz SoCs, the Nordic Semiconductor Global Tech Tour will take a team of the company's top wireless application technical experts on the road to deliver a free, high intensity training seminar designed to get embedded systems engineers up-to-speed within a day on how to build their first – or next generation – Bluetooth Smart or ANT+ wireless smartphone application accessories ('appcessories').
Nordic Semiconductor 
Nordic Semiconductor is a global leader within ultra-low power (watch battery) wireless technology, a field it pioneered. Today the company is also an associate member of the Bluetooth SIG and member of the SIG’s Board of Directors. Nordic contributed decades of core expertise in ultra-low power wireless to the development of Bluetooth low energy wireless technology – the hallmark feature of the latest Bluetooth v4.0 specification.

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