Micronas Offers 3D HAL® Sensor Families Now in Leaded Packages for Automotive Electronic Systems
May 28, 2013
Freiburg, May 28, 2013 – Micronas (SIX Swiss Exchange: MASN), known and recognized in the automotive and industrial business as a global partner for intelligent, sensor-based system solutions, today announces the successful start-up of the TO92UP package line at the production site in Freiburg. The HAL 36xy and HAL 38xy sensor families based on the 3D HAL technology for advanced linear distance and angular measurement will be the first devices available in the TO92UP package.
The 4-pin package TO92UP was developed at Micronas, Freiburg. The pins of this package are 5 mm longer compared to common TO92 packages. This extra length increases the flexibility for customers during the positioning of the sensors, especially in space limited applications. The plastic head with a thickness of only 1.5 mm enables the reliable measurement of magnetic fields, even in very small air-gaps.
Micronas’ HAL 36xy and HAL 38xy families for multidimensional magnetic field measurements enable various advanced application features in automotive electronics, e.g. the detection of the throttle valve position at angles of more than 90° or the measurement of linear movements up to a distance of 40 mm. The first 3D HAL family members HAL 3855 and HAL 3625 have only been available in the SOIC8 SMD package so far. Compared to soldered SMD packages, welded housings are more resistant against vibrations and high temperatures, which is especially important for applications in the engine compartment. Therefore, the new, leaded, weldable and solderable TO92UP package is the ideal solution for applications in high-temperature areas of up to TA=160 °C due to the fact that they require lead-frames as conductive carrier material for weld junctions.
Compared to the established TO92UT, the new 4-pin package TO92UP provides more area for integrated circuits (ICs) in spite of its comparatively small size. Thus, the integration of further features to fulfill the requirements of our customers’ future developments becomes possible.
“With this new package, Micronas combines its in-house packaging know-how of many years with current market trends. We see that the need for sensors with integrated components in the field of PCB free applications is steadily growing” explains Dirk Behrens, Vice President Automotive at Micronas. “With the TO92UP package, we are now offering our customers – besides the SOIC8 SMD version – a very robust package for all applications in the power train area in need of high reliability.”
The lead-frame of the new TO92UP package consists of non-ferromagnetic materials, so it does not influence the magnetic field to be measured. For the manufacturing process of the package, a specially developed low-stress molding compound is used, which minimizes the usually occurring mechanical stress to the housing. These features guarantee an excellent quality of the Hall sensor and enable very precise and highly reliable magnetic field measurements.
With the RoHS-compliant TO92UP, Micronas delivers one more “green package”. The investment into the newly installed TO92UP line is another commitment to sustainable environmental protection and a further step to the long-term preservation of the Freiburg site.
Micronas (SIX Swiss Exchange: MASN) is known and recognized in the automotive and industrial business as a reliable global partner for intelligent, sensor-based system solutions. Micronas offers a variety of Hall sensors and embedded controllers for smart actuators for automotive and industrial applications, such as drive trains, chassis frames, engine management and convenience functions.
Micronas serves all major automotive electronics customers worldwide, many of them in continuous partnerships seeking joint success. While the holding company is headquartered in Zurich (Switzerland), operational headquarters are based in Freiburg (Germany). Currently, the Micronas Group employs around 900 persons.